The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Nov. 17, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jung-Hyun Cho, Busan, KR;
Yong-Ho Baek, Seoul, KR;
Young-Gwan Ko, Seoul, KR;
Jae-Hoon Choi, Yongin-si, KR;
Jung-Hyun Park, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/11 (2006.01); H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H05K 1/187 (2013.01); H05K 3/42 (2013.01); H05K 2201/10015 (2013.01);
Abstract
An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.