The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Jan. 21, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Ho-Sik Park, Hwaseong-si, KR;
Dong-Keun Lee, Seoul, KR;
Jae-Hoon Choi, Yongin-si, KR;
Sang-Jae Lee, Suwon-si, KR;
Sung-Taek Lim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 3/40 (2006.01); H01L 23/538 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01); H05K 3/18 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H05K 1/187 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 23/5389 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H05K 3/007 (2013.01); H05K 3/025 (2013.01); H05K 3/181 (2013.01); H05K 3/188 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); H05K 3/4697 (2013.01);
Abstract
A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.