Ho-Sik Park

Title: Ho-Sik Park: Innovator in Printed Circuit Board Technology

Introduction

Ho-Sik Park is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of electronic components and printed circuit boards. With a total of 8 patents to his name, Park continues to push the boundaries of innovation in his industry.

Latest Patents

Among his latest patents is the "Electronic component embedded printed circuit board and method of manufacturing the same." This invention features a printed circuit board that includes an electronic component embedded in an insulation layer, with a connection terminal exposed on the surface. Additionally, a bump is formed on the connection terminal, enhancing its functionality. Another notable patent is the "Printed circuit board and manufacturing method thereof," which describes a printed circuit board with conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core. This design includes a first insulating material surrounding a portion of the glass core's side surface, providing improved structural integrity.

Career Highlights

Ho-Sik Park is currently employed at Samsung Electro-Mechanics Co., Ltd., where he applies his expertise in developing advanced electronic components. His work has been instrumental in enhancing the performance and reliability of printed circuit boards.

Collaborations

Throughout his career, Park has collaborated with notable colleagues, including Joon-Sik Shin and Sang-Youp Lee. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Ho-Sik Park's contributions to the field of printed circuit board technology exemplify his commitment to innovation. His patents reflect a deep understanding of electronic components and their applications, solidifying his reputation as a leading inventor in the industry.