The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Aug. 31, 2010
Joon-sik Shin, Suwon-si, KR;
Nobuyuki Ikeguchi, Suwon-si, KR;
Keungjin Sohn, Seoul, KR;
Joung Gul Ryu, Seoul, KR;
Sang-youp Lee, Seoul, KR;
Jung-hwan Park, Seongnam-si, KR;
Ho-sik Park, Hwaseong-si, KR;
Joon-Sik Shin, Suwon-si, KR;
Nobuyuki Ikeguchi, Suwon-si, KR;
Keungjin Sohn, Seoul, KR;
Joung Gul Ryu, Seoul, KR;
Sang-Youp Lee, Seoul, KR;
Jung-Hwan Park, Seongnam-si, KR;
Ho-Sik Park, Hwaseong-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.