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Seongnam-si, South Korea

Jung-Hwan Park

USPTO Granted Patents = 11 (Patent Applications = 5)

Average Co-Inventor Count = 3.9

ph-index = 2

Forward Citations = 19(Granted Patents)

Location History:

Chunan-si, KR (2010)
Seongnam-si, KP (2013)
Seongnam-si, KR (2011 - 2015)
Suwon-si, KR (2009 - 2021)

Company Filing History:

Samsung Electro-Mechanics Co., Ltd.

Samsung Sdi Co., Inc.

Years Active: 2009-2021

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11032901 - Printed circuit board and electronic device having the same (2021-06-08),

2. 8997340 - Method of manufacturing and insulating sheet (2015-04-07),

3. 8647926 - Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip (2014-02-11),

4. 8499441 - Method of manufacturing a printed circuit board (2013-08-06),

5. 8450618 - Printed circuit board with reinforced thermoplastic resin layer (2013-05-28),

6. 8397378 - Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board (2013-03-19),

7. 8174128 - Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method (2012-05-08),

8. 8030752 - Method of manufacturing semiconductor package and semiconductor plastic package using the same (2011-10-04),

9. 7893527 - Semiconductor plastic package and fabricating method thereof (2011-02-22),

10. 7649314 - Plasma display panel (2010-01-19),

11. 7501759 - Plasma display panel (2009-03-10),

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