The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2013
Filed:
Aug. 31, 2011
Keung-jin Sohn, Suwon-si, KR;
Joon-sik Shin, Suwon-si, KR;
Joung-gul Ryu, Seoul, KR;
Jung-hwan Park, Seongnam-si, KR;
Ho-sik Park, Hwaseong-si, KR;
Sang-youp Lee, Seoul, KR;
Keung-Jin Sohn, Suwon-si, KR;
Joon-Sik Shin, Suwon-si, KR;
Joung-Gul Ryu, Seoul, KR;
Jung-Hwan Park, Seongnam-si, KR;
Ho-Sik Park, Hwaseong-si, KR;
Sang-Youp Lee, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.