The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2013
Filed:
Sep. 25, 2008
Keung-jin Sohn, Suwon-si, KR;
Joon-sik Shin, Suwon-si, KR;
Joung-gul Ryu, Seoul, KR;
Jung-hwan Park, Seongnam-si, KP;
Ho-sik Park, Hwaseong-si, KR;
Sang-youp Lee, Seoul, KR;
Keung-Jin Sohn, Suwon-si, KR;
Joon-Sik Shin, Suwon-si, KR;
Joung-Gul Ryu, Seoul, KR;
Jung-Hwan Park, Seongnam-si, KP;
Ho-Sik Park, Hwaseong-si, KR;
Sang-Youp Lee, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-Si, KR;
Abstract
A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.