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For the Inventor, By the Inventor

Seoul, South Korea

Jae Baek Hwang

This inventor holds 17 USPTO granted patents and 4 published patent applications and 1 EPO patent. Top assignees: Hicon Co., Ltd., Other. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Baek Hwang. Retrieved from https://idiyas.com/inventor/jae-baek-hwang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 22(Granted Patents)


Company Filing History:

goldMedal8 out of 11 
 
Hicon Co., Ltd.
 patents
silverMedal15 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2016-2025

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17 patents (USPTO):Explore Patents
1. 12392798 - Socket device for testing ICS (2025-08-19),
2. 12248001 - Lidless BGA socket apparatus for testing semiconductor device (2025-03-11),
3. 12061212 - Spring contact and socket having spring contact embedded therein (2024-08-13),
4. 11982688 - Spring contact and test socket with same (2024-05-14),
5. 11668744 - Contact and socket device for burning-in and testing semiconductor IC (2023-06-06),
6. 11561241 - Spring contact and test socket with same (2023-01-24),
7. 11486897 - Contact and test socket device for testing semiconductor device (2022-11-01),
8. 11486896 - Contact and test socket device for testing semiconductor device (2022-11-01),
9. 11387584 - Contact pin for testing semiconductor IC for high speed signal, spring contact including same, and socket device (2022-07-12),
10. 10971843 - BGA socket device for testing BGA IC (2021-04-06),
11. 10955438 - Contact and socket device for testing semiconductor (2021-03-23),
12. 10935572 - Contact and test socket device for testing semiconductor device (2021-03-02),
13. 10761110 - Contact for testing semiconductor device, and test socket device therefor (2020-09-01),
14. 10466273 - Socket device for testing IC (2019-11-05),
15. 10241132 - Socket apparatus for semiconductor device test (2019-03-26),

Title: Innovations by Jae Baek Hwang

Introduction

Jae Baek Hwang is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit testing, holding a total of 17 patents. His innovative designs have advanced the technology used in semiconductor testing.

Latest Patents

One of his latest patents is a socket device for testing integrated circuits (ICs). This device includes a contact module designed for seating an IC and features multiple contacts for electrical connections between the IC leads and a printed circuit board (PCB). Additionally, it incorporates a pusher module that pressurizes the IC, enhancing the testing process. Another notable invention is the lidless BGA socket apparatus for testing semiconductor devices. This apparatus eliminates the cover typically found on socket bodies, allowing for unobstructed airflow during testing, which is crucial for accurate results.

Career Highlights

Throughout his career, Jae Baek Hwang has worked with various companies, including Hicon Co., Ltd. His work has been instrumental in developing advanced testing solutions for integrated circuits, showcasing his expertise in the field.

Collaborations

He has collaborated with notable individuals such as Dong Weon Hwang and Logan Jae Hwang, contributing to the advancement of technology in semiconductor testing.

Conclusion

Jae Baek Hwang's innovative contributions to integrated circuit testing have established him as a key figure in the field. His patents reflect a commitment to improving technology and enhancing testing methodologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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