The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Apr. 15, 2019
Applicants:
Hicon Co., Ltd., Gyeonggi-do, KR;
Dong Weon Hwang, Gyeonggi-do, KR;
Logan Jae Hwang, Flower Mound, TX (US);
Jae Baek Hwang, Seoul, KR;
Inventors:
Dong Weon Hwang, Gyeonggi-do, KR;
Logan Jae Hwang, Flower Mound, TX (US);
Jae Baek Hwang, Seoul, KR;
Assignees:
HICON CO., LTD., Seongnam-si, KR;
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01); H01R 13/629 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0483 (2013.01); G01R 1/07314 (2013.01); G01R 31/2886 (2013.01); H01R 13/62905 (2013.01); H01R 2201/20 (2013.01);
Abstract
The present invention relates to a BGA socket apparatus which is a lidless-type from which a cover, generally provided on the top part of a socket body in order for the loading/unloading operation of an IC, is removed, the BGA socket apparatus enabling the elimination of elements which may obstruct air flow during testing.
Quick Actions:
Hwang, Dong. (2025). Lidless bga socket apparatus for testing semiconductor device (U.S. Patent No. 12248001). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12248001
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile