The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Oct. 09, 2019
Applicants:

Dong Weon Hwang, Gyeonggi-do, KR;

Logan Jae Hwang, Flower Mound, TX (US);

Jae Baek Hwang, Seoul, KR;

Inventors:

Dong Weon Hwang, Gyeonggi-do, KR;

Logan Jae Hwang, Flower Mound, TX (US);

Jae Baek Hwang, Seoul, KR;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/15 (2006.01); H01R 13/193 (2006.01); G01R 1/04 (2006.01); G01R 31/28 (2006.01); H01R 13/502 (2006.01); H01R 13/629 (2006.01);
U.S. Cl.
CPC ...
H01R 13/193 (2013.01); G01R 1/0483 (2013.01); G01R 31/2886 (2013.01); H01R 13/15 (2013.01); H01R 13/502 (2013.01); H01R 13/629 (2013.01); H01R 2201/20 (2013.01);
Abstract

Disclosed is a BGA socket device used for testing a BGA IC and having a dual pinch type contact. The BGA socket device includes: contacts each including a fixed terminal and a movable terminal and configured such that respective upper ends of the fixed and movable terminals are offset from each other with respect to each solder ball of the IC; a main body in which the contact is provided and fixed; a cover supported on an upper surface of the main body and configured to be movable up and down; and a slider provided between the main body and the cover and configured to slide left and right, thus opening and closing the movable terminal in a horizontal direction, the slider having a fixed terminal receiving hole and a movable terminal receiving hole in which the fixed and movable terminals of the contact are received, respectively, by passing therethrough.


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Quick Actions:

Hwang, Dong. (2021). Bga socket device for testing bga ic (U.S. Patent No. 10971843). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10971843

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