The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Apr. 27, 2015
Dong Weon Hwang, Seoul, KR;
Hicon Co., Ltd., Seongnam-si, Gyeonggido, KR;
Jae Suk Hwang, Berkeley, CA (US);
Jae Baek Hwang, Seoul, KR;
Other;
HICON CO., LTD., Seongnam-si, Gyeonggi-do, KR;
Abstract
Disclosed a socket apparatus for a semiconductor device test, the apparatus including: body elements () into which contacts () are inserted; movable elements () on which a semiconductor device (IC) is seated; a socket cover () assembled to the movable elements () and resiliently assembled to the body elements (); and a semiconductor device pressing part () pressing and fixing the semiconductor device (IC) seated on the movable elements (), wherein the semiconductor device pressing part () includes: a pusher plate () having an opening cam () and coming into surface contact with an upper surface of the semiconductor device (IC) and applies pressure thereto; a latch () of which ends are hingedly assembled to the socket cover () and the pusher plate (); and a link () of which ends are hingedly assembled to the socket body () and the latch ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile