The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Nov. 02, 2018
Applicants:

Dong Weon Hwang, Gyeonggi-do, KR;

Logan Jae Hwang, Flower Mound, TX (US);

Jae Baek Hwang, Seoul, KR;

Inventors:

Dong Weon Hwang, Gyeonggi-do, KR;

Logan Jae Hwang, Flower Mound, TX (US);

Jae Baek Hwang, Seoul, KR;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 31/28 (2006.01); H01R 13/11 (2006.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0466 (2013.01); G01R 1/0458 (2013.01); G01R 31/2863 (2013.01); H01R 13/111 (2013.01); H01R 13/2414 (2013.01); H01R 13/2421 (2013.01);
Abstract

Disclosed are a hybrid-type contact and a socket device for testing a semiconductor device, in which the hybrid-type contact includes a first contact unit integrally configured by rolling a predetermined shaped strip pattern formed by blanking a metal plate into a cylindrical shape, a second contact unit with conductivity and elasticity configured to be inserted into the first contact unit, and a molding portion of insulating elastic material configured to integrally fix the first contact unit and the second contact unit together, so as to compensate the disadvantages of conventional pin-type and rubber-type test socket devices, whereby it is easy to optimize the mechanical and electrical properties according to the requirements of the test device, and it is suitable for testing a fine pitch device.


Find Patent Forward Citations

Quick Actions:

Hwang, Dong. (2021). Contact and socket device for testing semiconductor (U.S. Patent No. 10955438). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10955438

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…