Location History:
- Daejeon, KR (2011 - 2018)
- Sejong-si, KR (2020 - 2021)
Company Filing History:
Years Active: 2011-2021
Title: Innovations of Hyun-cheol Bae
Introduction
Hyun-cheol Bae is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of electronics and telecommunications, holding a total of 12 patents. His work focuses on advanced methods for semiconductor packaging and laser bonding techniques.
Latest Patents
One of his latest patents is a laser bonding method. This method involves forming a bonding part that includes an adhesive layer and conductive particles on a substrate. The process aligns a bonding target on the bonding part and uses a pressing part to apply pressure while heating the bonding target with a laser. This innovative approach ensures that the conductive particles create an electrical connection between the substrate and the bonding target. Another notable patent is a method of fabricating a semiconductor package. This method includes preparing a package substrate and mounting a semiconductor chip using a resin layer that contains solder and reducing agent granules. The chip is bonded to the substrate pad through laser irradiation, showcasing Bae's expertise in semiconductor technology.
Career Highlights
Hyun-cheol Bae works at the Electronics and Telecommunications Research Institute, where he has been instrumental in developing cutting-edge technologies. His innovative methods have the potential to enhance the efficiency and reliability of electronic devices.
Collaborations
He collaborates with notable colleagues such as Kwang-Seong Choi and Yong Sung Eom, contributing to a dynamic research environment that fosters innovation.
Conclusion
Hyun-cheol Bae's contributions to the field of electronics and telecommunications through his patents and collaborative efforts highlight his role as a leading inventor. His work continues to influence advancements in semiconductor technology and laser bonding methods.