Daejeon, South Korea

Hyun-cheol Bae

USPTO Granted Patents = 12 

Average Co-Inventor Count = 4.6

ph-index = 3

Forward Citations = 20(Granted Patents)


Location History:

  • Daejeon, KR (2011 - 2018)
  • Sejong-si, KR (2020 - 2021)

Company Filing History:


Years Active: 2011-2021

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12 patents (USPTO):Explore Patents

Title: Innovations of Hyun-cheol Bae

Introduction

Hyun-cheol Bae is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of electronics and telecommunications, holding a total of 12 patents. His work focuses on advanced methods for semiconductor packaging and laser bonding techniques.

Latest Patents

One of his latest patents is a laser bonding method. This method involves forming a bonding part that includes an adhesive layer and conductive particles on a substrate. The process aligns a bonding target on the bonding part and uses a pressing part to apply pressure while heating the bonding target with a laser. This innovative approach ensures that the conductive particles create an electrical connection between the substrate and the bonding target. Another notable patent is a method of fabricating a semiconductor package. This method includes preparing a package substrate and mounting a semiconductor chip using a resin layer that contains solder and reducing agent granules. The chip is bonded to the substrate pad through laser irradiation, showcasing Bae's expertise in semiconductor technology.

Career Highlights

Hyun-cheol Bae works at the Electronics and Telecommunications Research Institute, where he has been instrumental in developing cutting-edge technologies. His innovative methods have the potential to enhance the efficiency and reliability of electronic devices.

Collaborations

He collaborates with notable colleagues such as Kwang-Seong Choi and Yong Sung Eom, contributing to a dynamic research environment that fosters innovation.

Conclusion

Hyun-cheol Bae's contributions to the field of electronics and telecommunications through his patents and collaborative efforts highlight his role as a leading inventor. His work continues to influence advancements in semiconductor technology and laser bonding methods.

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