The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Dec. 02, 2011
Jong Tae Moon, Daejeon, KR;
Yong Sung Eom, Daejeon, KR;
Hyun-cheol Bae, Daejeon, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Abstract
Disclosed is a vacuum wafer level packaging method for a micro electro mechanical system device, including: forming a plurality of via holes on an upper wafer for protecting a micro electro mechanical system (MEMS) wafer; forming at least one metal layer on inner walls of the plurality of via holes and regions extended from the plurality of via holes; arranging and bonding the upper wafer and the MEMS wafer at atmospheric pressure; applying solder paste to the regions extended from the plurality of via holes; filling a solder in the plurality of via holes by increasing the temperature of a high-vacuum chamber to melt the solder paste; and changing the solder in the plurality of via holes to a solid state by lowering the temperature of the high-vacuum chamber.