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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9538666 B1

PDFFull Text
Date of Patent:
Jan. 03, 2017

Filed:

Mar. 18, 2014

Bonding structure of electronic equipment

Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Kwang-Seong Choi, Daejeon, KR;

Hyun-cheol Bae, Daejeon, KR;

Haksun Lee, Daejeon, KR;

Yong Sung Eom, Daejeon, KR;

Assignee:

ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon, KR;

Attorney:
Primary Examiner:

Binh Tran

Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 3/34 (2006.01); H01L 23/48 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H01L 23/48 (2013.01); H05K 1/0283 (2013.01); H05K 1/189 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/613 (2015.11);
Abstract

Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

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