The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Aug. 28, 2018
Electronics and Telecommunications Research Institute, Daejeon, KR;
Kwang-Seong Choi, Daejeon, KR;
Yong-Sung Eom, Daejeon, KR;
Keon-Soo Jang, Daejeon, KR;
Seok Hwan Moon, Daejeon, KR;
Hyun-Cheol Bae, Sejong-si, KR;
Ieeseul Jeong, Seoul, KR;
Wagno Alves Braganca Junior, Incheon, KR;
Electronics and Telecommunications Reearch Institute, Daejeon, KR;
Abstract
Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.