Company Filing History:
Years Active: 2020
Title: The Innovative Contributions of Ieeseul Jeong
Introduction
Ieeseul Jeong is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for fabricating semiconductor packages.
Latest Patents
Ieeseul Jeong holds a patent for a "Method of Fabricating a Semiconductor Package." This method involves preparing a package substrate with a substrate pad and mounting a semiconductor chip on it. The process includes forming a resin layer containing solder and reducing agent granules with a first capsule layer, which is placed between the chip pad of the semiconductor chip and the substrate pad. The bonding of the chip pad to the substrate pad is achieved using laser irradiation directed at the semiconductor chip. This innovative method enhances the efficiency and reliability of semiconductor packaging.
Career Highlights
Ieeseul Jeong is affiliated with the Electronics and Telecommunications Research Institute, where he has been instrumental in advancing semiconductor technologies. His work has not only contributed to the institute's reputation but has also paved the way for future innovations in the field.
Collaborations
Ieeseul Jeong has collaborated with notable colleagues, including Kwang-Seong Choi and Yong-Sung Eom. Their combined expertise has fostered a productive research environment, leading to groundbreaking advancements in semiconductor technology.
Conclusion
Ieeseul Jeong's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology. His work continues to influence the industry and inspire future inventors.