Wagno Alves Braganca Junior

Title: Wagno Alves Braganca Junior: Innovator in Semiconductor Packaging

Introduction

Wagno Alves Braganca Junior is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of semiconductor packages. His innovative approach has led to the development of a unique method that enhances the efficiency and reliability of semiconductor packaging.

Latest Patents

Wagno holds a patent for a "Method of fabricating a semiconductor package." This method involves preparing a package substrate with a substrate pad and mounting a semiconductor chip on it. The process includes forming a resin layer containing solder and reducing agent granules, which are encapsulated, and bonding the chip pad to the substrate pad using laser irradiation. This innovative technique improves the overall performance of semiconductor devices.

Career Highlights

Wagno is affiliated with the Electronics and Telecommunications Research Institute, where he continues to advance his research and development efforts. His work has been instrumental in pushing the boundaries of semiconductor technology, making him a valuable asset to his organization and the industry as a whole.

Collaborations

Wagno has collaborated with esteemed colleagues such as Kwang-Seong Choi and Yong-Sung Eom. Their combined expertise has fostered a productive environment for innovation and has led to significant advancements in their field.

Conclusion

Wagno Alves Braganca Junior is a prominent figure in the semiconductor industry, recognized for his innovative methods and contributions. His work not only enhances semiconductor packaging but also sets a foundation for future advancements in technology.