This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Electronics and Telecommunications Research Institute. Active years: 2020.
Company Filing History:
Years Active: 2020
Title: Keon-Soo Jang: Innovator in Semiconductor Packaging
Introduction
Keon-Soo Jang is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for fabricating semiconductor packages.
Latest Patents
Keon-Soo Jang holds a patent for a "Method of fabricating a semiconductor package." This method involves preparing a package substrate with a substrate pad and mounting a semiconductor chip on it. The process includes forming a resin layer containing solder and reducing agent granules with a first capsule layer, which is placed between the chip pad of the semiconductor chip and the substrate pad. The bonding of the chip pad to the substrate pad is achieved using laser irradiation directed at the semiconductor chip. He has 1 patent to his name.
Career Highlights
Keon-Soo Jang is associated with the Electronics and Telecommunications Research Institute, where he has been instrumental in advancing semiconductor packaging technologies. His work has garnered attention for its innovative techniques and practical applications in the electronics industry.
Collaborations
Keon-Soo Jang has collaborated with notable colleagues, including Kwang-Seong Choi and Yong-Sung Eom. Their combined expertise has contributed to the success of various projects within their research institution.
Conclusion
Keon-Soo Jang's contributions to semiconductor packaging represent a significant advancement in the field. His innovative methods and collaborative efforts continue to influence the electronics industry positively.