The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Mar. 18, 2013
Applicant:
Electronics and Telecommunications Research Institute, Daejeon, KR;
Inventors:
Kwang-Seong Choi, Daejeon, KR;
Ho-eun Bae, Gyeongsangnam-do, KR;
Hyun-cheol Bae, Daejeon, KR;
Yong Sung Eom, Daejeon, KR;
Su Jeong Jeon, Jeollabuk-do, KR;
Assignee:
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B23K 1/20 (2006.01); H01L 23/00 (2006.01); B23K 3/06 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); H01L 24/11 (2013.01); B23K 3/0623 (2013.01);
Abstract
A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.