This inventor holds 1 USPTO granted patent. Top assignee: Electronics and Telecommunications Research Institute. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Su Jeong Jeon: Inventor in Semiconductor Packaging
Introduction
Su Jeong Jeon is an inventor associated with the Electronics and Telecommunications Research Institute in Jeollabuk-do, South Korea. Her work includes a patent on fabricating solder-on-pad structures and using them in flip-chip bonding.
Latest Patents
Jeon is named on 1 patent: “Method of Fabricating a Solder-on-Pad Structure and Flip-Chip Bonding Method Using the Same.” The method describes coating a substrate with a solder bump maker containing resin and solder powder, then heating it below the solder powder’s melting point so the powder aggregates on a pad. The resin is subsequently removed.
Career Highlights
The patent addresses a process for forming solder-on-pad structures, which can be used in flip-chip bonding. Jeon’s listed institutional affiliation is the Electronics and Telecommunications Research Institute.
Collaborations
Kwang-Seong Choi and Ho-eun Bae are identified as Jeon’s coworkers.
Conclusion
Su Jeong Jeon’s patent documents a solder-on-pad fabrication approach intended for flip-chip bonding, reflecting her work in electronic packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile