This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2002-2009.
Location History:
- Kyunggi-Do, KR (2002 - 2009)
- Paju-Si, KR (2006 - 2009)
Company Filing History:
Years Active: 2002-2009
Title: Hyeongno Kim: Innovator in Semiconductor Technology
Introduction
Hyeongno Kim is a prominent inventor based in Paju-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on developing innovative solutions that enhance the performance and reliability of semiconductor packages.
Latest Patents
Hyeongno Kim's latest patents include an EMI shielded semiconductor package and a semiconductor package structure with a method for manufacturing the same. The EMI shielded semiconductor package is designed to protect chips from electromagnetic interference. It features a substrate with a chip connected by bonding wires, and a shielding conductive block that is grounded. A sealant covers the chip and bonding wires, while a conductive film shields the chip from external interference. The semiconductor package structure patent outlines a design that includes a substrate, interposer, and multiple chips, ensuring effective electrical connections and grounding.
Career Highlights
Hyeongno Kim is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His innovative designs have contributed to advancements in the industry, making him a valuable asset to his company.
Collaborations
Hyeongno Kim has collaborated with notable colleagues, including Sangbae Park and HyungJun Park. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge semiconductor solutions.
Conclusion
Hyeongno Kim's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of semiconductor packaging and performance.