The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Dec. 26, 2006
Hyeongno Kim, Paju-si, KR;
Hyeongno Kim, Paju-si, KR;
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Abstract
A semiconductor package structure and a method for manufacturing the same are disclosed. The semiconductor package structure includes a substrate, an interposer (such as a circuitry laminate), a metal layer formed on the interposer, a first chip and a second chip, wherein the interposer is disposed on the substrate and covers at least a portion of an opening of the substrate, thereby defining a space for receiving the first chip, and the second chip is disposed on the metal layer or the interposer. The metal layer is electrically connected to the substrate and grounded. The first chip is electrically connected to the substrate.