HuiLi Fu

This inventor holds 10 USPTO granted patents and 8 published patent applications and 8 EPO patents. Top assignee: Huawei Technologies Co., Limited. Active years: 2016-2022.

USPTO Granted Patents = 10 (Patent Applications = 8)

% Patents Active = 70.0

EPO Patents = 8 (Patent Applications = 14)

Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 14(Granted Patents)

Company Filing History:

10 out of 27,557

Huawei Technologies Co., Limited

patents

Years Active: 2016-2022

Loading Chart...

10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11462520 - Chip integration module, chip package structure, and chip integration method (2022-10-04),

2. 11276645 - Encapsulation of a substrate electrically connected to a plurality of pin arrays (2022-03-15),

3. 11189927 - Patch antenna unit and antenna (2021-11-30),

4. 10903135 - Chip package structure and manufacturing method thereof (2021-01-26),

5. 10784181 - Apparatus and manufacturing method (2020-09-22),

6. 10727595 - Patch antenna unit and antenna (2020-07-28),

7. 10607913 - Integrated circuit die and manufacture method thereof (2020-03-31),

8. 10475741 - Chip (2019-11-12),

9. 9681549 - Conical inductor, printed circuit board, and optical module (2017-06-13),

10. 9349708 - Chip stacked package structure and electronic device (2016-05-24),

Title: Innovations of HuiLi Fu in Chip Integration Technology

Introduction

HuiLi Fu is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of chip integration technology, holding a total of 10 patents. His work focuses on enhancing the performance and efficiency of chip packaging and integration methods.

Latest Patents

HuiLi Fu's latest patents include a chip integration module, a chip package structure, and a chip integration method. The chip integration module he developed consists of a die, a passive device, and a connecting piece. This innovative design allows for easy integration and reduces costs. The shorter path connecting the die to the passive device improves the performance of the passive device. Additionally, his chip package structure involves a molding body that wraps around various components to create an integral structure, facilitating high-density interconnection among different dies.

Career Highlights

HuiLi Fu is currently employed at Huawei Technologies Co., Limited, where he continues to push the boundaries of chip technology. His work has been instrumental in advancing the capabilities of modern electronic devices.

Collaborations

Some of his notable coworkers include Shujie Cai and Liangsheng Liu, who contribute to the innovative environment at Huawei.

Conclusion

HuiLi Fu's contributions to chip integration technology exemplify the spirit of innovation in the electronics industry. His patents reflect a commitment to improving performance and efficiency in chip design and packaging.