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For the Inventor, By the Inventor

Shenzhen, China

HuiLi Fu

USPTO Granted Patents = 10 

 

Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:

goldMedal10 out of 27,225 
 
Huawei Technologies Co., Limited
 patents

Years Active: 2016-2022

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10 patents (USPTO):Explore Patents
1. 11462520 - Chip integration module, chip package structure, and chip integration method (2022-10-04),
2. 11276645 - Encapsulation of a substrate electrically connected to a plurality of pin arrays (2022-03-15),
3. 11189927 - Patch antenna unit and antenna (2021-11-30),
4. 10903135 - Chip package structure and manufacturing method thereof (2021-01-26),
5. 10784181 - Apparatus and manufacturing method (2020-09-22),
6. 10727595 - Patch antenna unit and antenna (2020-07-28),
7. 10607913 - Integrated circuit die and manufacture method thereof (2020-03-31),
8. 10475741 - Chip (2019-11-12),
9. 9681549 - Conical inductor, printed circuit board, and optical module (2017-06-13),
10. 9349708 - Chip stacked package structure and electronic device (2016-05-24),
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