The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Jul. 30, 2018
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Liangsheng Liu, Shenzhen, CN;

Xinhong Li, Hsinchu, TW;

HuiLi Fu, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H01Q 21/06 (2006.01); H01Q 23/00 (2006.01); H01Q 21/00 (2006.01); H01Q 1/48 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01Q 9/045 (2013.01); H01Q 9/0457 (2013.01); H01Q 21/0075 (2013.01); H01Q 21/065 (2013.01); H01Q 23/00 (2013.01);
Abstract

A patch antenna unit and an antenna that relate to the field of communications technology wherein the patch antenna unit includes a first support layer, a substrate, a second support layer, and an integrated circuit that are stacked. One radiation patch is attached to the first support layer, and one radiation patch is attached to the second support layer. A ground layer is disposed on the second support layer, a coupling slot is disposed on the ground layer, and a feeder corresponding to the coupling slot is disposed on the second support layer. The integrated circuit is connected to the first ground layer and the feeder. In the foregoing specific technical solution, a four-layer substrate is used for fabrication.


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