Zhubei, Taiwan

Hui-Chi Huang

USPTO Granted Patents = 35 

Average Co-Inventor Count = 4.2

ph-index = 4

Forward Citations = 42(Granted Patents)


Location History:

  • Taipei, TW (2013 - 2016)
  • Hsinchu County, TW (2016 - 2022)
  • Hsin-Chu, TW (2018 - 2023)
  • Zhubei, TW (2017 - 2024)

Company Filing History:


Years Active: 2013-2025

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35 patents (USPTO):

Title: Innovator Hui-Chi Huang: Revolutionizing Wafer Polishing Technology

Introduction: Hui-Chi Huang, a prominent inventor based in Zhubei, Taiwan, has made significant contributions to the semiconductor industry with an impressive portfolio of 32 patents. His innovations focus on enhancing the efficiency and effectiveness of wafer polishing processes, which are crucial for the production of semiconductor devices.

Latest Patents: Among his latest innovations is an "Electrical Cleaning Tool for Wafer Polishing Tool System." This invention outlines a method for polishing wafers using a slurry that contains electrically charged abrasive particles. The process involves the application of contrasting electrical charges to first and second conductive rods, as well as the utilization of a wafer brush to optimize cleaning performance. Another notable patent from Huang is the "Self-Healing Polishing Pad," which features microcapsules that release a polymer material when the pad is damaged. Exposure to ultraviolet light allows the polymer to cure, thereby healing the pad and extending its lifespan significantly compared to conventional polishing pads.

Career Highlights: Hui-Chi Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leader in the semiconductor manufacturing space. His extensive work on innovations related to wafer polishing has positioned him as a key figure in improving the manufacturing processes within the industry.

Collaborations: Throughout his career, Huang has collaborated with notable colleagues, including Kei-Wei Chen and Chun-Hao Kung. These partnerships have fostered an environment of innovation and shared expertise, further enhancing the development of cutting-edge polishing technologies.

Conclusion: Hui-Chi Huang exemplifies the spirit of innovation in the semiconductor industry. His patents not only reflect his technical prowess but also address critical challenges in wafer polishing, leading to more efficient manufacturing processes. As technological advancements continue to evolve, Huang's contributions will undoubtedly play a vital role in shaping the future of semiconductor technology.

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