The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Jun. 30, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Yen-Ting Chen, Taichung, TW;
Chun-Hao Kung, Hsinchu, TW;
Tung-Kai Chen, New Taipei, TW;
Hui-Chi Huang, Zhubei, TW;
Kei-Wei Chen, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); B24B 57/02 (2006.01); B24B 37/04 (2012.01); B01F 13/08 (2006.01); C09K 3/14 (2006.01); B01F 33/452 (2022.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); B01F 33/452 (2022.01); B24B 37/04 (2013.01); B24B 57/02 (2013.01); C09K 3/1427 (2013.01);
Abstract
A chemical-mechanical polishing (CMP) system includes a head, a polishing pad, and a magnetic system. The slurry used in the CMP process contains magnetizable abrasives. Application and control of a magnetic field, by the magnetic system, allows precise control over how the magnetizable abrasives in the slurry may be drawn toward the wafer or toward the polishing pad.