The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Jun. 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Jeng-Chi Lin, Hsinchu, TW;
Chi-Hsiang Shen, Tainan, TW;
Te-Chien Hou, Kaohsiung, TW;
Tang-Kuei Chang, Tainan, TW;
Chi-Jen Liu, Taipei, TW;
Hui-Chi Huang, Hsinchu, TW;
Kei-Wei Chen, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
Provided is a chemical-mechanical polishing apparatus, a retaining ring for a chemical-mechanical polishing apparatus, and a chemical-mechanical polishing method. A chemical-mechanical polishing apparatus includes a polishing pad; a polishing head configured to receive a wafer and to hold the wafer against the polishing pad; and a retaining ring configured to engage with the polishing head, wherein the retaining ring is formed with channels configured for flowing a slurry in a flow direction from outside the retaining ring to inside the retaining ring, wherein the channels have a cross-sectional flow area that decreases in the flow direction.