Hsinchu, Taiwan

Jeng-Chi Lin

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.7

ph-index = 1


Company Filing History:


Years Active: 2023-2025

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4 patents (USPTO):

Title: Innovations by Jeng-Chi Lin

Introduction

Jeng-Chi Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on improving processes and tools used in the manufacturing of semiconductor wafers.

Latest Patents

One of his latest patents is titled "Bevel edge removal methods, tools, and systems." This invention discloses a tool and methods for removing films from the bevel regions of wafers. The bevel film removal tool features an inner motor nested within an outer motor, along with a bevel brush secured to the outer motor. The bevel brush can be adjusted radially outward to allow the wafer to be inserted and secured to the inner motor. Once engaged, a solution can be dispensed, and both motors can be rotated to remove bevel films chemically and mechanically.

Another notable patent is "In-situ defect count detection in post chemical mechanical polishing." This invention provides a method for detecting defects on the surface of a semiconductor wafer after chemical mechanical polishing. A light signal is scanned over a target area, and the reflected light signal is analyzed to determine the defect count present in that area.

Career Highlights

Jeng-Chi Lin works at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative approaches have contributed to advancements in wafer processing technologies.

Collaborations

He collaborates with notable colleagues, including Kei-Wei Chen and Chi-Jen Liu, who share his commitment to innovation in semiconductor manufacturing.

Conclusion

Jeng-Chi Lin's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in wafer processing and defect detection methods.

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