Taiwan Semiconductor Manufacturing Comp. Ltd.

Jeng-Chi Lin

Kei-Wei Chen

Liang-Guang Chen

Chi-Jen Liu

Hui-Chi Huang

Pin-Chuan Su

Chien-Ming Wang

Chun-Wei Hsu

Huang-Lin Chao

Yi-Sheng Lin

Chun-Hung Liao

Ting-Hsun Chang

Ji Cui

Jian-Ci Lin

Chih-chieh Chang

A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.

Bevel edge removal methods, tools, and systems

In-situ defect count detection in post chemical mechanical polishing (post-CMP) is provided. Post-CMP is performed, in-situ and according to a recipe, on a surface of a semiconductor wafer within a post-CMP chamber. A light signal is scanned over a target area of the surface of the semiconductor wafer and a reflected light signal reflected from the target area is detected. A defect count of defects present in the target area is determined based on the reflected light signal reflected from the target area.

In-situ defect count detection in post chemical mechanical polishing

A slurry composition, a semiconductor structure and a method for forming a semiconductor structure are provided. The slurry composition includes a slurry and a precipitant dispensed in the slurry. The semiconductor structure comprises a blocking layer including at least one element of the precipitant. The method includes using the slurry composition with the precipitant to polish a conductive layer and causing the precipitant to flow into the gap.

Slurry composition, semiconductor structure and method for forming the same

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Hsinchu, Taiwan

Jeng-Chi Lin