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For the Inventor, By the Inventor

Hsinchu, Taiwan

Hsu-Hsien Chen

USPTO Granted Patents = 12 

Average Co-Inventor Count = 5.5

ph-index = 5

Forward Citations = 218(Granted Patents)


Company Filing History:

goldMedal12 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

where 'Filed Patents' based on already Granted Patents

12 patents (USPTO):
1. 12451396 - Semiconductor package and method of forming same (2025-10-21),
2. 11742276 - Semiconductor package and manufacturing process thereof (2023-08-29),
3. 11315860 - Semiconductor package and manufacturing process thereof (2022-04-26),
4. 10535593 - Package structure having a plurality of conductive balls with narrow width for ball waist (2020-01-14),
5. 10276481 - Package structure having a plurality of conductive balls having narrow width for the ball waist (2019-04-30),
6. 10037973 - Method for manufacturing semiconductor package structure (2018-07-31),
7. 9576821 - Package structures including a capacitor and methods of forming the same (2017-02-21),
8. 9490167 - Pop structures and methods of forming the same (2016-11-08),
9. 9478474 - Methods and apparatus for forming package-on-packages (2016-10-25),
10. 9406629 - Semiconductor package structure and manufacturing method thereof (2016-08-02),
11. 8975726 - POP structures and methods of forming the same (2015-03-10),
12. 8653626 - Package structures including a capacitor and methods of forming the same (2014-02-18),

Title: The Innovative Mind of Hsu-Hsien Chen: A Technology Pioneer in Semiconductor Packaging

Introduction: Hsu-Hsien Chen, a prominent inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 11 patents, Chen has established himself as a leading figure in the industry. His innovative approaches to semiconductor packaging represent a critical advancement in manufacturing processes and design.

Latest Patents: Among Hsu-Hsien Chen's notable recent patents is a groundbreaking semiconductor package and the associated manufacturing process. This invention involves an interposer with a unique crystal structure. In the process, both a first die and a second die are bonded to the interposer. Notably, the second die is positioned apart from the first die, with a gap that extends in a perpendicular direction to the shortest distance between them. This gap's orientation does not align with the crystallographic structure of the interposer. The packaging process concludes with the formation of a molding compound, which encapsulates the dies, followed by cutting the structure into individual packages.

Career Highlights: Hsu-Hsien Chen is currently affiliated with Taiwan Semiconductor Manufacturing Company Limited, where he continues to drive innovation in semiconductor technology. His work is characterized by a commitment to enhancing manufacturing efficiency and product performance, showcasing his expertise and vision in the field.

Collaborations: Throughout his career, Hsu-Hsien Chen has collaborated with notable coworkers like Chen-Shien Chen and Chih-Hua Chen. These partnerships have fostered an environment of creativity and collaboration, essential for pioneering advancements in semiconductor technologies.

Conclusion: Hsu-Hsien Chen's distinguished career as an inventor reflects his dedication to transforming semiconductor packaging processes. His innovative patents not only highlight his technical expertise but also promise to influence the future of technology dramatically. With continued efforts and collaborations, Chen is poised to further advance the semiconductor industry, solidifying his legacy as a significant contributor to technology innovation.

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