The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Feb. 10, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Hsu-Hsien Chen, Hsin-Chu, TW;
Chih-Hua Chen, Zhubei, TW;
En-Hsiang Yeh, Hsin-Chu, TW;
Monsen Liu, Zhudong Township, TW;
Chen-Shien Chen, Zhubei, TW;
Assignee:
Taiwan Semiconductor Manufactoring Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 21/683 (2006.01); H01L 25/03 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76885 (2013.01); H01L 21/6835 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/83 (2013.01); H01L 25/03 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 21/568 (2013.01); H01L 24/97 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.