The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Dec. 28, 2012
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Hsu-Hsien Chen, Hsin-Chu, TW;
Chih-Hua Chen, Jhubei, TW;
En-Hsiang Yeh, Hsin-Chu, TW;
Monsen Liu, Zhudong Township, TW;
Chen-Shien Chen, Zhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Methods and apparatus are disclosed for a package or a package-on-package (PoP) device. An IC package or a PoP device may comprise an electrical path connecting a die and a decoupling capacitor, wherein the electrical path may have a width in a range from about 8 um to about 44 um and a length in a range from about 10 um to about 650 um. The decoupling capacitor and the die may be contained in a same package, or at different packages within a PoP device, connected by contact pads, redistribution layers (RDLs), and connectors.