This inventor holds 8 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2011-2017.
Company Filing History:
Years Active: 2011-2017
Title: Hsiu-Ping Wei: Innovator in Bump Pad Structures
Introduction
Hsiu-Ping Wei is a notable inventor based in Dajia Town, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work primarily focuses on innovative bump pad structures that enhance the performance and reliability of semiconductor devices.
Latest Patents
One of Hsiu-Ping Wei's latest patents is a bump pad structure that includes a substrate with a top layer and a reinforcement pad. This structure features an intermediate layer above the top layer, an intermediate connection pad on the intermediate layer, and an outer layer above the intermediate layer. Additionally, an under bump metal (UBM) connects to the intermediate connection pad through an opening in the outer layer. The patent also describes various embodiments, including a via that mechanically couples the intermediate connection pad to the reinforcement pad. This via can take different forms, such as a solid via, a substantially ring-shaped via, or a five by five array of vias. Furthermore, the invention may include a secondary reinforcement pad and a second via that connects the reinforcement pad to the secondary reinforcement pad.
Career Highlights
Hsiu-Ping Wei is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate and develop new technologies. His expertise in semiconductor manufacturing has positioned him as a key player in the industry.
Collaborations
Hsiu-Ping Wei has collaborated with several talented individuals, including Hao-Yi Tsai and Hsien-Wei Chen, who contribute to the advancement of semiconductor technologies alongside him.
Conclusion
Hsiu-Ping Wei's contributions to the field of semiconductor technology through his innovative bump pad structures demonstrate his commitment to advancing the industry. His work not only enhances device performance but also showcases the importance of collaboration in technological advancements.