The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2012
Filed:
Apr. 09, 2010
Hsiu-ping Wei, Dajia Town, TW;
Shin-puu Jeng, Hsinchu, TW;
Hao-yi Tsai, Hsinchu, TW;
Hsien-wei Chen, Sinying, TW;
Yu-wen Liu, Taipei, TW;
Ying-ju Chen, Tuku Township, TW;
Tzuan-horng Liu, Longtan Township, TW;
Hsiu-Ping Wei, Dajia Town, TW;
Shin-Puu Jeng, Hsinchu, TW;
Hao-Yi Tsai, Hsinchu, TW;
Hsien-Wei Chen, Sinying, TW;
Yu-Wen Liu, Taipei, TW;
Ying-Ju Chen, Tuku Township, TW;
Tzuan-Horng Liu, Longtan Township, TW;
Abstract
A semiconductor package structure is provided. The structure includes a semiconductor chip having a plurality of interconnect layers formed thereover. A first passivation layer is formed over the plurality of interconnect layers. A stress buffer layer is formed over the first passivation layer. A bonding pad is formed over the stress buffer layer. A second passivation layer is formed over a portion of the bonding pad, the second passivation having at least one opening therein exposing a portion of the bonding pad.