Enter inventor name

Yu-Wen Liu

This inventor holds 30 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Glycolysis Biomed Co., Ltd., Pegatron Corporation. Active years: 2011-2023.

USPTO Granted Patents = 30 (Patent Applications = 3)

% Patents Active = 80.0

Average Co-Inventor Count = 4.2

ph-index = 6

Forward Citations = 198(Granted Patents)

Location History:

Hsin-Chu, TW (2017)
Taipei, TW (2011 - 2023)

Company Filing History:

24 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

2 out of 2

Glycolysis Biomed Co., Ltd.

Compal Electronics, Inc.

patents

5. 1 out of 834,453

Other

patents

Years Active: 2011-2023

Loading Chart...

Areas of Expertise:

Beta-lactam Compounds

Glucose Metabolism Disorder

Electronic Device Casing

Bond Pad Structure

Bump Pad Structure

Integrated Circuit

Heat Spreader Structures

Dielectric Layer Delamination

Semiconductor Test Pad

Docking Station

Flip-Chip Packaging

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11564908 - Beta-lactam compounds or salts thereof for use in long-acting prevention or treatment of a glucose metabolism disorder (2023-01-31),

2. 11523532 - Electronic device casing (2022-12-06),

3. 11419852 - Beta-lactam compounds or salts thereof for use in long-acting prevention or treatment of a glucose metabolism disorder (2022-08-23),

4. 11330728 - Handle extension structure and electronic device casing (2022-05-10),

5. 9859235 - Underbump metallization structure (2018-01-02),

6. 9646954 - Integrated circuit with test circuit (2017-05-09),

7. 9601446 - Method of fabricating a bond pad structure (2017-03-21),

8. 9536847 - Bump pad structure (2017-01-03),

9. 9239592 - Docking station (2016-01-19),

10. 9171811 - Bump pad structure (2015-10-27),

11. 9138422 - Method of using antimycin A to downregulate Wnt/b-catenin pathway to treat gefitinib resistant cancer (2015-09-22),

12. 9117831 - Seal ring structure for integrated circuit chips (2015-08-25),

13. 8981580 - Bond pad structure (2015-03-17),

14. 8907478 - Bump pad structure (2014-12-09),

15. 8860208 - Heat spreader structures in scribe lines (2014-10-14),

Title: The Innovative Journey of Yu-Wen Liu

Introduction:

Yu-Wen Liu, a pioneering inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions and patents.

Latest Patents:

Yu-Wen Liu's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights:

With a career spanning over two decades, Yu-Wen Liu has established himself as a leading figure in the tech industry, holding numerous patents that have revolutionized various sectors. His dedication to pushing the boundaries of what is possible has earned him recognition worldwide.

Collaborations:

Throughout his career, Yu-Wen Liu has collaborated with top research institutions, leading companies, and brilliant minds in the industry. These collaborations have not only enhanced the impact of his inventions but have also paved the way for future innovations.

Conclusion:

In conclusion, Yu-Wen Liu's passion for innovation, coupled with his relentless drive to create solutions for the challenges of tomorrow, solidifies his position as a trailblazer in the world of inventions. His work continues to inspire and shape the future of technology, leaving a lasting legacy in the realm of innovation.

Profile summary based on public USPTO records.

Please report any incorrect information to [email protected]