The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9646954 B1

PDF
Full Text
Expired
Date of Patent:
May. 09, 2017

Filed:

Apr. 13, 2011
Applicants:

Shih-wei Liang, Dajia Township, TW;

Yu-wen Liu, Taipei, TW;

Hsien-wei Chen, Sinying, TW;

Inventors:

Shih-Wei Liang, Dajia Township, TW;

Yu-Wen Liu, Taipei, TW;

Hsien-Wei Chen, Sinying, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/10 (2006.01); H01L 25/065 (2006.01); H01L 21/66 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 22/34 (2013.01); H01L 23/522 (2013.01); H01L 24/14 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05096 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14179 (2013.01); H01L 2224/14515 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/00014 (2013.01);
Abstract

An integrated circuit system comprising a first integrated and at least one of a second integrated circuit, interposer or printed circuit board. The first integrated circuit further comprising a wiring stack, bond pads electrically connected to the wiring stack, and bump balls formed on the bond pads. First portions of the wiring stack and the bond pads form a functional circuit, and second portions of the wiring stack and the bond pads form a test circuit. A portion of the bump balls comprising dummy bump balls. The dummy bump balls electrically connected to the second portions of the wiring stack and the bond pads. The at least one of the second integrated circuit, interposer or printed circuit board forming a portion of the test circuit.


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