The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Feb. 08, 2011
Applicants:

Hsien-wei Chen, Sinying, TW;

Yu-wen Liu, Taipei, TW;

Jyh-cherng Sheu, Hsin-Chu, TW;

Hao-yi Tsai, Hsin-Chu, TW;

Shin-puu Jeng, Hsin-Chu, TW;

Chen-hua Yu, Hsin-Chu, TW;

Shang-yun Hou, Jubei, TW;

Inventors:

Hsien-Wei Chen, Sinying, TW;

Yu-Wen Liu, Taipei, TW;

Jyh-Cherng Sheu, Hsin-Chu, TW;

Hao-Yi Tsai, Hsin-Chu, TW;

Shin-Puu Jeng, Hsin-Chu, TW;

Chen-Hua Yu, Hsin-Chu, TW;

Shang-Yun Hou, Jubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/58 (2006.01); H01L 21/78 (2006.01); H01L 23/367 (2006.01); B23K 26/36 (2014.01); B23K 26/40 (2014.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 22/34 (2013.01); H01L 23/585 (2013.01); H01L 21/78 (2013.01); B23K 26/367 (2013.01); B23K 26/409 (2013.01);
Abstract

An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.


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