The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Nov. 16, 2009
Yu-wen Liu, Taipei, TW;
Hao-yi Tsai, Hsin-Chu, TW;
Hsien-wei Chen, Sinying, TW;
Shin-puu Jeng, Hsin-Chu, TW;
Ying-ju Chen, Tuku Township, TW;
Shang-yun Hou, Jubei, TW;
Pei-haw Tsao, Tai-Chung, TW;
Chen-hua Yu, Hsin-Chu, TW;
Yu-Wen Liu, Taipei, TW;
Hao-Yi Tsai, Hsin-Chu, TW;
Hsien-Wei Chen, Sinying, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Ying-Ju Chen, Tuku Township, TW;
Shang-Yun Hou, Jubei, TW;
Pei-Haw Tsao, Tai-Chung, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A system and method for forming an underbump metallization (UBM) is presented. A preferred embodiment includes a raised UBM which extends through a passivation layer so as to make contact with a contact pad while retaining enough of the passivation layer between the contact pad and the UBM to adequately handle the peeling and shear stress that results from CTE mismatch and subsequent thermal processing. The UBM contact is preferably formed in either an octagonal ring shape or an array of contacts.