The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Mar. 30, 2010
Tzuan-horng Liu, Longtan Township, TW;
Shang-yun Hou, Jubei, TW;
Shin-puu Jeng, Hsin-Chu, TW;
Wei-cheng Wu, Hsin-Chu, TW;
Hsiu-ping Wei, Dajia Town, TW;
Chih-hua Chen, Jhubei, TW;
Chen-cheng Kuo, Chu-Pei, TW;
Chen-shien Chen, Zhubei, TW;
Ming Hung Tseng, Toufen Township, TW;
Tzuan-Horng Liu, Longtan Township, TW;
Shang-Yun Hou, Jubei, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Wei-Cheng Wu, Hsin-Chu, TW;
Hsiu-Ping Wei, Dajia Town, TW;
Chih-Hua Chen, Jhubei, TW;
Chen-Cheng Kuo, Chu-Pei, TW;
Chen-Shien Chen, Zhubei, TW;
Ming Hung Tseng, Toufen Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, unknown;
Abstract
An integrated circuit structure includes a semiconductor chip, a metal pad at a major surface of the semiconductor chip, and an under-bump metallurgy (UBM) over and contacting the metal pad. A metal bump is formed over and electrically connected to the UBM. A dummy pattern is formed at a same level, and formed of a same metallic material, as the metal pad.