The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2014
Filed:
Mar. 22, 2012
Tzuan-horng Liu, Longtan Township, TW;
Shang-yun Hou, Jubei, TW;
Shin-puu Jeng, Hsin-Chu, TW;
Wei-cheng Wu, Hsin-Chu, TW;
Hsiu-ping Wei, Dajia Town, TW;
Chih-hua Chen, Jhubei, TW;
Chen-cheng Kuo, Chu-Pei, TW;
Chen-shien Chen, Zhubei, TW;
Ming Hung Tseng, Toufen Township, TW;
Tzuan-Horng Liu, Longtan Township, TW;
Shang-Yun Hou, Jubei, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Wei-Cheng Wu, Hsin-Chu, TW;
Hsiu-Ping Wei, Dajia Town, TW;
Chih-Hua Chen, Jhubei, TW;
Chen-Cheng Kuo, Chu-Pei, TW;
Chen-Shien Chen, Zhubei, TW;
Ming Hung Tseng, Toufen Township, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of forming an integrated circuit structure is provided. The method includes forming a metal pad at a major surface of a semiconductor chip, forming an under-bump metallurgy (UBM) over the metal pad such that the UBM and the metal pad are in contact, forming a dummy pattern at a same level as the metal pad, the dummy pattern formed of a same metallic material as the metal pad and electrically disconnected from the metal pad, and forming a metal bump over the UBM such that the metal bump is electrically connected to the UBM and no metal bump in the semiconductor chip is formed over the dummy pattern.