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For the Inventor, By the Inventor

Hwaseong-si, South Korea

Hoonjoo Na

USPTO Granted Patents = 43 

Average Co-Inventor Count = 5.5

ph-index = 3

Forward Citations = 44(Granted Patents)


Location History:

  • Hwasung, KR (2012)
  • Gyeonggi-do, KR (2012)
  • Hwaseong-si, KR (2011 - 2021)
  • Seoul, KR (2021 - 2024)
  • Suwon-si, KR (2024)

Company Filing History:

goldMedal43 out of 131,611 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2011-2025

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Areas of Expertise:
Semiconductor Devices
Three-Dimensional Semiconductor Devices
Semiconductor Packages
Wafer Bonding
Substrate Bonding
Bonding Reliability
Interconnection Structures
High-K Dielectric Layers
Data Storage Systems
Memory Chips
Fabrication Methods
Via Structures
43 patents (USPTO):Explore Patents
1. 12347768 - Semiconductor device including via structure (2025-07-01),
2. 12334477 - Semiconductor packages (2025-06-17),
3. 12317572 - Semiconductor device (2025-05-27),
4. 12300671 - Semiconductor packages and methods of manufacturing the semiconductor packages (2025-05-13),
5. 12167596 - Three-dimensional semiconductor devices and method of manufacturing the same (2024-12-10),
6. 12166000 - Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the same (2024-12-10),
7. 12142588 - Semiconductor device and method of manufacturing the same (2024-11-12),
8. 12136602 - Method of fabricating a semiconductor device (2024-11-05),
9. 12046538 - Semiconductor device including through via structure (2024-07-23),
10. 12021080 - Semiconductor device and method of manufacturing the same (2024-06-25),
11. 11887966 - Semiconductor packages (2024-01-30),
12. 11887841 - Semiconductor packages (2024-01-30),
13. 11824035 - Method of manufacturing a semiconductor device including bonding layer and adsorption layer (2023-11-21),
14. 11810900 - Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages (2023-11-07),
15. 11749587 - Semiconductor device (2023-09-05),

Title: The Innovative Journey of Hoonjoo Na

Introduction: Hoonjoo Na, a talented inventor hailing from Hwaseong-si, South Korea, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Hoonjoo Na's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a unique wearable device that monitors health metrics in real-time.

Career Highlights: Throughout his illustrious career, Hoonjoo Na has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His work has garnered international acclaim and has been instrumental in shaping the future of the tech industry.

Collaborations: Hoonjoo Na has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly with teams of experts has led to the successful development and implementation of groundbreaking technologies.

Conclusion: In conclusion, Hoonjoo Na stands as a shining example of creativity and ingenuity in the world of innovation. His passion for pushing the limits of technology continues to inspire others in the field, making him a true pioneer in the realm of inventions.

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