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For the Inventor, By the Inventor

Paya Terubong, Malaysia

Hoay Tien Teoh

USPTO Granted Patents = 13

Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 54(Granted Patents)


Location History:

  • Penang, MY (2018)
  • Paya Terubong, MY (2016 - 2023)

Company Filing History:

goldMedal13 out of 54,781 
 
Intel Corporation
 patents

Years Active: 2016-2025

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13 patents (USPTO):Explore Patents
1. 12500155 - Electronic package with passive component between substrates (2025-12-16),
2. 11696409 - Vertical embedded component in a printed circuit board blind hole (2023-07-04),
3. 11264315 - Electronic package with passive component between substrates (2022-03-01),
4. 10861839 - Dynamic random access memory (DRAM) mounts (2020-12-08),
5. 10785872 - Package jumper interconnect (2020-09-22),
6. 10492299 - Electronic assembly that includes a substrate bridge (2019-11-26),
7. 10411001 - Dynamic random access memory (DRAM) mounts (2019-09-10),
8. 10163777 - Interconnects for semiconductor packages (2018-12-25),
9. 9972589 - Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer (2018-05-15),
10. 9960224 - Three capacitor stack and associated methods (2018-05-01),
11. 9907170 - FPC connector for better signal integrity and design compaction (2018-02-27),
12. 9613920 - Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias (2017-04-04),
13. 9257368 - Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias (2016-02-09),

Title: **Innovative Pathways: The Journey of Inventor Hoay Tien Teoh**

Introduction

Hoay Tien Teoh, an inventive mind hailing from Paya Terubong, Malaysia, has made significant strides in the field of electronics with his impressive portfolio of 12 patents. His contributions to the design and functionality of electronic components showcase his dedication to innovation within the industry.

Latest Patents

Among his latest inventions, Hoay has developed groundbreaking patents such as the "Vertical Embedded Component in a Printed Circuit Board Blind Hole." This invention involves a printed circuit board (PCB) featuring a blind via that houses a discrete component vertically embedded within it. Another notable development is the "Electronic Package with Passive Component Between Substrates," which encapsulates an electronic assembly where passive components are strategically positioned between two substrates. This design ensures optimal communication and functionality between integrated devices, showcasing Hoay's innovative approach to electronic packaging.

Career Highlights

Hoay Tien Teoh is currently associated with Intel Corporation, a leader in technological advancements and innovations. Through his position at Intel, he has been able to leverage his expertise to contribute to the evolving landscape of electronic design and manufacturing. His work is instrumental in pioneering new technologies that enhance performance and efficiency in electronic systems.

Collaborations

Hoay collaborates with talented colleagues, including Eng Huat Goh and Min Suet Lim, at Intel Corporation. Together, they push the boundaries of electronics innovation, sharing insights and expertise in order to advance their projects and create cutting-edge solutions within the industry.

Conclusion

Hoay Tien Teoh stands as a testament to the power of innovation in technology. With a robust portfolio of patents and a bright future ahead, he continues to shape the electronic landscape through his inventive spirit and collaborative efforts at Intel Corporation. His contributions not only highlight his own skills but also the importance of teamwork in the pursuit of groundbreaking technologies.

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