The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Nov. 13, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Eng Huat Goh, Penang, MY;

Hoay Tien Teoh, Paya Terubong, MY;

Jia Yan Go, Kulim, MY;

Jenny Shio Yin Ong, Bayan Lepas, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 7/06 (2006.01); H05K 7/20 (2006.01); H01L 23/02 (2006.01); H01L 23/13 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 25/105 (2013.01); H05K 3/34 (2013.01); H05K 3/3436 (2013.01); H01L 2224/81203 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/613 (2015.11);
Abstract

The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package; a second memory module mounted to the printed circuit board; and a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.


Find Patent Forward Citations

Loading…