Hiroshi Ishizaki

Title: Hiroshi Ishizaki: Innovator in Electronic Component Manufacturing

Introduction

Hiroshi Ishizaki is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of electronic components, holding a total of 6 patents. His innovative methods and designs have advanced the technology used in electronic devices.

Latest Patents

One of Ishizaki's latest patents is a method of manufacturing an electronic component unit. This method involves preparing a circuit board with a heat-generating element and a bonding metal foil layer. It also includes a heat transfer board with an insulative layer and a heat transfer metal foil layer. The process entails applying cream solder to form a solder layer, superimposing the bonding and heat transfer metal foil layers, and re-melting the solder layer to create a solid connection. Additionally, he has developed a magnetic head for thermally assisted magnetic recording. This slider is designed for magnetic data recording in a thermally assisted recording system, featuring a magnetic recording head and terminals for electrical connectivity.

Career Highlights

Throughout his career, Ishizaki has worked with prominent companies such as Honda Elesys Co., Ltd. and Hitachi Global Storage Technologies Netherlands B.V. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the electronics sector.

Collaborations

Ishizaki has collaborated with notable professionals in his field, including Hiroshi Inaba and Seiji Yamashita. These partnerships have fostered innovation and have led to the development of advanced technologies in electronic components.

Conclusion

Hiroshi Ishizaki's contributions to electronic component manufacturing and his innovative patents highlight his role as a significant inventor in the industry. His work continues to influence the development of electronic technologies, showcasing the importance of innovation in this field.