The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Feb. 09, 2011
Seiji Yamashita, Kanagawa, JP;
Tamotsu Teshima, Kanagawa, JP;
Amane Murao, Kanagawa, JP;
Hiroshi Ishizaki, Kanagawa, JP;
Takashi Honda, Kanagawa, JP;
Hitoshi Kuroyanagi, Kanagawa, JP;
Tomoyuki Masubuchi, Kanagawa, JP;
Seiji Yamashita, Kanagawa, JP;
Tamotsu Teshima, Kanagawa, JP;
Amane Murao, Kanagawa, JP;
Hiroshi Ishizaki, Kanagawa, JP;
Takashi Honda, Kanagawa, JP;
Hitoshi Kuroyanagi, Kanagawa, JP;
Tomoyuki Masubuchi, Kanagawa, JP;
Honda Elesys Co., Ltd., Yokohama, JP;
Abstract
According to embodiments, there is provided an electronic component unit, including: a circuit board including: a heat generating element that generates a heat; and a bonding metal foil layer formed on a face thereof; a heat transfer board including: a board body having a thermal conductivity higher than that of the circuit board; an insulative layer formed on a first face of the board body; and a heat transfer metal foil layer formed to cover the insulative layer; and a heat sink, wherein the circuit board is assembled with the heat sink via the heat transfer board such that (1) the heat transfer metal foil layer is soldered to the bonding metal foil layer and (2) the second face of the board body is superimposed on the heat sink.