Company Filing History:
Years Active: 2014-2015
Title: Tamotsu Teshima: Innovator in Electronic Component Manufacturing
Introduction
Tamotsu Teshima is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of electronic component manufacturing, holding 2 patents that showcase his innovative approaches.
Latest Patents
Teshima's latest patents include a method of manufacturing an electronic component unit. This method involves preparing a circuit board with a heat-generating element and a bonding metal foil layer. It also includes a heat transfer board with an insulative layer and a heat transfer metal foil layer, along with a heat sink. The process entails applying cream solder to form a solder layer, superimposing the bonding and heat transfer metal foil layers, and re-melting the solder layer to create a solid connection. Another patent focuses on an electronic component unit that consists of a circuit board with a heat-generating element, a heat transfer board with enhanced thermal conductivity, and a heat sink, all assembled to optimize heat management.
Career Highlights
Tamotsu Teshima is currently employed at Honda Elesys Co., Ltd., where he continues to develop innovative solutions in electronic components. His work has significantly impacted the efficiency and performance of electronic devices.
Collaborations
Teshima has collaborated with notable coworkers, including Seiji Yamashita and Amane Murao, contributing to a dynamic team focused on advancing technology in their field.
Conclusion
Tamotsu Teshima's contributions to electronic component manufacturing highlight his innovative spirit and dedication to improving technology. His patents reflect a deep understanding of thermal management in electronic devices, making him a valuable asset in the industry.