The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Apr. 24, 2014
Honda Elesys Co., Ltd., Yokohama, JP;
Seiji Yamashita, Kanagawa, JP;
Tamotsu Teshima, Kanagawa, JP;
Amane Murao, Kanagawa, JP;
Hiroshi Ishizaki, Kanagawa, JP;
Takashi Honda, Kanagawa, JP;
Hitoshi Kuroyanagi, Kanagawa, JP;
Tomoyuki Masubuchi, Kanagawa, JP;
HONDA ELESYS CO., LTD., Yokohama, JP;
Abstract
An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.