Company Filing History:
Years Active: 2014-2015
Title: Amane Murao: Innovator in Electronic Component Manufacturing
Introduction
Amane Murao is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of electronic component manufacturing, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
Murao's latest patents include a method of manufacturing an electronic component unit. This method involves preparing a circuit board with a heat-generating element and a bonding metal foil layer. It also includes a heat transfer board with an insulative layer and a heat transfer metal foil layer, along with a heat sink. The process entails applying cream solder to form a solder layer, superimposing the bonding metal foil layer and the heat transfer metal foil layer, and re-melting the solder layer to create a solid connection. Additionally, he has developed an electronic component unit that consists of a circuit board with a heat-generating element, a heat transfer board with higher thermal conductivity, and a heat sink, all assembled to optimize heat management.
Career Highlights
Murao is currently employed at Honda Elesys Co., Ltd., where he continues to innovate in the field of electronic components. His work has been instrumental in advancing manufacturing techniques that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Murao has collaborated with talented individuals such as Seiji Yamashita and Tamotsu Teshima. These partnerships have contributed to the development of cutting-edge technologies in the industry.
Conclusion
Amane Murao's contributions to electronic component manufacturing reflect his dedication to innovation and excellence. His patents and work at Honda Elesys Co., Ltd. demonstrate his impact on the field, paving the way for future advancements in technology.