Hitachi Global Storage Technologies Netherlands B.v.

Hgst Netherlands, B.v.

Honda Elesys Co., Ltd.

Hiroshi Ishizaki

Hiroshi Inaba

Takashi Honda

Seiji Yamashita

Hitoshi Kuroyanagi

Tomoyuki Masubuchi

Tamotsu Teshima

Amane Murao

Shinji Sasaki

Hideo Yamakura

Shigehiko Fujimaki

Nobuto Yasui

Mineaki Kodama

Atsuko Okawa

Hidetoshi Anan

Tomomitsu Inoue

An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.

Method of manufacturing electronic component unit

A slider for magnetic data recording in a thermally assisted recording system. The slider has a slider body and a magnetic recording head formed on a trailing edge of the slider body. A first terminal is formed on a trailing edge surface of the recording head, and a second terminal is formed on a backside surface both the magnetic recording head and the slider body so as to extend across both the magnetic recording head and the slider body. An electrically conductive lead formed within the magnetic recording head connects the first lead with the second lead.

Magnetic head for thermally assisted magnetic recording

According to embodiments, there is provided an electronic component unit, including: a circuit board including: a heat generating element that generates a heat; and a bonding metal foil layer formed on a face thereof; a heat transfer board including: a board body having a thermal conductivity higher than that of the circuit board; an insulative layer formed on a first face of the board body; and a heat transfer metal foil layer formed to cover the insulative layer; and a heat sink, wherein the circuit board is assembled with the heat sink via the heat transfer board such that (1) the heat transfer metal foil layer is soldered to the bonding metal foil layer and (2) the second face of the board body is superimposed on the heat sink.

Electronic component unit and manufacturing method thereof

In one embodiment, a magnetic head includes at least one magnetic head element for reading from and/or writing to a magnetic medium, the element having an air bearing surface (ABS) facing toward a magnetic medium, an adhesive film including silicon nitride above the ABS having a characteristic of being formed under a water vapor partial pressure, and a protective film above the adhesive film, the protective film including carbon. Also, in another embodiment, a method includes forming an ABS of a magnetic head, the ABS being a surface of the magnetic head which is closest to a magnetic medium when in use, forming an adhesive film above the ABS of the magnetic head, the adhesive film being formed under a water vapor partial pressure, and forming a protective film above the adhesive film, the protective film including carbon.

Air bearing surface overcoat with soft intermediate film, and methods of producing the same

To promote reduction in thickness of an air bearing surface protective film of a magnetic head, a magnetic head having an air bearing surface protective film consisting only of a thin carbon film while excluding formation of a dead layer by ion incidence as less as possible to the read/write device, and a manufacturing method therefore, are provided. In an embodiment, an air bearing surface protective film of a magnetic head comprises a thin carbon film, in which the mass density a lowermost layer of the air bearing surface protective film on the side of a magnetic device is made lower compared with a thin carbon film constituting other adjacent layers. Further, the manufacturing method comprises deposition under the control of time for the incident angle of ion flow to a substrate to be processed and deposition under the control of time for the ion flow energy to a substrate to be processed.

Magnetic head with air bearing surface protection film and manufacturing method thereof

Embodiments of the invention provide an air bearing surface protection film having good corrosive resistance, electrical insulative property and mechanical wear resistance in the state of an extremely thin film. In one embodiment, an air bearing surface protection film having good corrosive resistance, electrical insulative property and mechanical wear resistance in a state of an extremely thin film is obtained by disposing a thin silicon nitride film having high density, high electric resistance, chemical stability and high adhesion with a substrate as a lowermost air bearing surface protection film and disposing a film comprising tetrahedral amorphous carbon and nitrogen as an uppermost air bearing surface protection film.

Magnetic head with air bearing surface protection film

Growing community of inventors

Kanagawa, Japan

Hiroshi Ishizaki